S035-50 – Laser Cutting Machine


Features:

-S035-50 laser scribing machine adopts Nd:YAG laser oscillator
-Cross worktable, dual workstation vacuum acetabula and Han’s self developed control software
-S035-50 is the most popular and practical machine model in solar silicon slicing market

Application:

S035-50 laser scribing machine is widely used in the slicing of monocrystalline silicon, polycrystalline silicon solar battery and silicon wafer in solar industry; and in the cutting of fragile items, some soft metal and non-metal sheet

Model S035-50
Laser type YAG
Laser wavelength  1064nm
Max. laser power  50W
Beam quality M2  ≤10
Max. positionging speed 150mm/s
Max. cutting speed 120mm/s
Max. cutting depth 0.8mm
Min. line width 0.04mm
Repetition position accuracy ≤0.02mm
Position accuracy ≤±0.02mm
Working area 350×350mm
Power consumption 5kW
Power supply 380V/50Hz/20A
Weight 455kg
Dimension(LxWxH) 1750×1150×720mm

S035-50 – Laser Cutting Samples