Model | S035-50 |
Laser type | YAG |
Laser wavelength | 1064nm |
Max. laser power | 50W |
Beam quality M2 | ≤10 |
Max. positionging speed | 150mm/s |
Max. cutting speed | 120mm/s |
Max. cutting depth | 0.8mm |
Min. line width | 0.04mm |
Repetition position accuracy | ≤0.02mm |
Position accuracy | ≤±0.02mm |
Working area | 350×350mm |
Power consumption | 5kW |
Power supply | 380V/50Hz/20A |
Weight | 455kg |
Dimension(LxWxH) | 1750×1150×720mm |
S035-50 – Laser Cutting Machine
Features:
-S035-50 laser scribing machine adopts Nd:YAG laser oscillator
-Cross worktable, dual workstation vacuum acetabula and Han’s self developed control software
-S035-50 is the most popular and practical machine model in solar silicon slicing market
Application:
S035-50 laser scribing machine is widely used in the slicing of monocrystalline silicon, polycrystalline silicon solar battery and silicon wafer in solar industry; and in the cutting of fragile items, some soft metal and non-metal sheet
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FS02-20 – Laser Cutting Machine
0 out of 5(0)Features:
-High slicing accuracy, high speed and easy to operate
-Fixed optic path, manual focusing and red light indication
-Servo motor and lead screw transmission, high accuracy, long serving time and low noise
-Air cooling fiber oscillator, high laser quality, small focusing facular, good stability and small machine sizeApplication:
FS02-20 fiber laser scribing machine is widely used in the slicing of monocrystalline silicon, polycrystalline silicon solar battery and silicon wafer in solar industry and is widely used in the cutting of fragile items, some soft metals and non-metal mat.
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